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| INTEGRATED CIRCUITS DATA SHEET UAA3540TS DECT receiver Product specification File under Integrated Circuits, IC17 2000 Feb 15 Philips Semiconductors Product specification DECT receiver FEATURES * Single-chip RF plus IF * Integrated channel filter * Low component count * No production trimming * High dynamic range * Low power * 3.2 V operation * Built-in power-down mode. QUICK REFERENCE DATA VCC = 3.2 V; Tamb = 25 C; unless otherwise specified. SYMBOL VCC ICC ICC(pd) Tamb PARAMETER supply voltage supply current power-down mode supply current ambient temperature CONDITIONS over Tamb MIN. 3.0 - - -10 GENERAL DESCRIPTION UAA3540TS The UAA3540TS is a low-power, highly integrated circuit, for Digital Enhanced Cordless Telecommunication (DECT) applications. It features a fully integrated channel selection filter, an analog Received Signal Strength Indicator (RSSI) and a switched demodulator output to interface to Philips Semiconductors ABC baseband chip. The circuit can be fully powered down during the idle locked state. TYP. 3.2 34 10 - MAX. 3.6 45 50 +60 UNIT V mA A C ORDERING INFORMATION TYPE NUMBER UAA3540TS PACKAGE NAME SSOP20 DESCRIPTION plastic shrink small outline package; 20 leads; body width 4.4 mm VERSION SOT266-1 2000 Feb 15 2 Philips Semiconductors Product specification DECT receiver BLOCK DIAGRAM UAA3540TS handbook, full pagewidth LOA 17 MIXER LOB 18 x LIMITER RFA RFB 5 6 0 90 x MIXER LIMITER 8 RSET 15 RSSI D E M O D U L A T O R UAA3540TS 13 1 k 11 DATA+ DATA- 10 SLCCTR FCA040 Fig.1 Block diagram. 2000 Feb 15 3 Philips Semiconductors Product specification DECT receiver PINNING SYMBOL GND(LO) PD VCC(RF) GND(RF) RFA RFB GND(IF) RSET TEST1 SLCCTR DATA- TEST2 DATA+ TEST3 RSSI VCC(IF) LOA LOB VCC(LO) TEST4 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION local oscillator ground power-down control input (logic 1 disables the chip) RF positive supply voltage RF ground RF balanced input A RF balanced input B IF ground set filter (connect to external resistor) test 1 (connect to GND) slicer threshold switch control input (logic 1 closes the switch) switched demodulator output test 2 (connect to GND) demodulator digital signal output test 3 (connect to VCC) received signal strength intensity voltage output IF positive supply local oscillator balanced input A local oscillator balanced input B local oscillator positive supply test 4 (connect to GND) VCC(RF) 3 GND(RF) 4 RFA 5 handbook, halfpage UAA3540TS GND(LO) 1 PD 2 20 TEST4 19 VCC(LO) 18 LOB 17 LOA 16 VCC(IF) 15 RSSI 14 TEST3 13 DATA+ 12 TEST2 11 DATA- FCA039 UAA3540TS RFB 6 GND(IF) 7 RSET 8 TEST1 9 SLCCTR 10 Fig.2 Pin configuration. 2000 Feb 15 4 Philips Semiconductors Product specification DECT receiver FUNCTIONAL DESCRIPTION General The UAA3540TS is a fully integrated RF plus IF strip and demodulator for DECT applications. It provides all the required channel filtering over the DECT band and generates analog RSSI and a data output for the baseband chip. Very few off-chip components are required and should not require trimming in normal applications. The chip is designed to operate from a power supply voltage which can fall to 3.0 V, and features full power-down capabilities. The inputs are an RF antenna signal and a Local Oscillator (LO) signal. The RF antenna signal is from a band filter or antenna switch. The higher frequency LO signal is from an external Voltage Controlled Oscillator (VCO). The outputs are an RSSI voltage, representing the instantaneous signal strength, and DATA- and DATA+ which are two high-level demodulator output signals. DATA- is switched by SLCCTR to generate a threshold voltage for the internal slicer, and DATA+ is the comparator digital output. Filter The integrated filter provides all the channel selectivity required for the DECT receiver. An external resistor of 18 k must be connected to RSET (pin 8). Limiter and RSSI UAA3540TS The main purpose of the limiter circuit is to reduce the dynamic range of the signals presented to the demodulator; these have a dynamic range greater than 60 dB. The limiter also provides the RSSI output voltage. The RSSI output has very little filtering applied, and it is assumed that external circuits will be used to provide the time constant and peak holding required by the DECT specification. Demodulator The demodulator produces an output voltage directly proportional to the instantaneous frequency of the received signal. The output stage of the demodulator contains a data filter to remove high frequencies from the signal, prior to data slicing. The demodulator provides a continuous output timing signal that is applied to an internal data slicer. The same signal is also switched to generate the threshold voltage of the slicer during the initial DECT bit sequence. Power-down The power-down control input (pin 2) allows the current consumption of the chip to be reduced to a very low level when it is connected to VCC. In this state, some voltages in the chip become indeterminate requiring time for the receiver to stabilize after power-up. 2000 Feb 15 5 Philips Semiconductors Product specification DECT receiver LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC Vi(PD); Vi(SLCCTR) Pi(max) Tj(max) P(max) Tstg HANDLING All pins withstand 1500 V ESD test in accordance with "EIA/JESD22-A114 Class1 (Feb. 96)". THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 152 supply voltage input voltage on pins PD and SLCCTR maximum input power maximum operating junction temperature maximum power dissipation in quiet air storage temperature PARAMETER MIN. -0.3 -0.3 - - - -55 UAA3540TS MAX. +3.6 +3.6 15 150 180 +125 V V UNIT dBm C mW C UNIT K/W DC CHARACTERISTICS VCC = 3.2 V; Tamb = 25 C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS Tamb 25 C MIN. TYP. MAX. UNIT Supply (Pins VCC(LO), VCC(RF) and VCC(IF)) VCC ICC ICC(pd) VIH VIL Ii(bias) supply voltage supply current power-down mode supply current 3.0 - - 1.4 -0.3 logic 1 or 0 -5 3.2 34 10 - - - 3.6 45 50 V mA A V V A Interface logic input signal levels (Pins PD and SLCCTR) HIGH-level input voltage LOW-level input voltage input bias current VCC +0.4 +5 2000 Feb 15 6 Philips Semiconductors Product specification DECT receiver UAA3540TS AC CHARACTERISTICS VCC = 3.2 V; Tamb = 25 C; modulation deviation f = 288 kHz; measured on Philips Semiconductors characterization board at the RF balun input; unless otherwise specified. SYMBOL Pin RSSI VRSSI twake Systems SB.3 SB.5 IM3 sensitivity of RF input sensitivity of RF input intermodulation rejection BER 10-3; note 1 BER 10-5; note 1 - - -95 -92 40 -93 -76 - dBm dBm dBc RSSI output voltage monotonic over range -96 to -36 dBm period between power-up signal and valid RSSI output (wake-up time) with -36 dBm at RF input with -96 dBm at RF input no external capacitor on the RSSI output - - - 1.7 0.3 25 2 - 40 V V s PARAMETER CONDITIONS MIN. TYP. MAX. UNIT unwanted interferers level 33 in channels N + 2 and N + 4 referred to wanted at -83 dBm in channel 5 for BER < 10-3; note 1 co-channel interferer level -10 referred to wanted at -76 dBm both in channel 5 for BER < 10-3; note 1 adjacent channel 13 interferer level referred to wanted at -76 dBm in channel 5 for BER < 10-3; note 1 bi-adjacent channel 34 interferer level referred to wanted at -76 dBm in channel 5 for BER < 10-3; note 1 40 N 3 adjacent channel interferer level referred to wanted at -76 dBm in channel 5 for BER < 10-3; note 1 unwanted CW level 37 referred to wanted at -83 dBm in channel 5 for BER < 10-3; note 1 52 Rco co-channel rejection -8 - dBc Rj(N + 1) adjacent channel rejection 19 - dBc Rj(N + 2) bi-adjacent channel rejection 40 - dBc Rj(N + 3) 3 channels rejection 44 - dBc Blf > 6 MHz rejection of a blocking signal in the range lf - fcl > 6 MHz 55 - dBc Blnear1 rejection of a blocking signal in the ranges: f(RF)(min) - 100 MHz < f < f(RF)(min) - 5 MHz; f(RF)(max) + 5 MHz < f < f(RF)(max) + 100 MHz rejection of a blocking signal in the ranges: f(RF)(min) - 300 MHz < f < f(RF)(min) - 100 MHz; f(RF)(max) + 100 MHz < f < f(RF)(max) + 300 MHz 58 - dBc Blnear2 52 58 - dBc 2000 Feb 15 7 Philips Semiconductors Product specification DECT receiver UAA3540TS SYMBOL Blfarlow PARAMETER rejection of a blocking signal in the range: 25 MHz < f MIN. 37 TYP. MAX. 58 - UNIT dBc Blfarhigh rejection of a blocking signal in the range: f(RF)(max) + 300 MHz < f < 4.32 GHz 47 58 - dBc BFG1 rejection of a blocking signal in occurrence around: FG1 = 2835.648 MHz 37 45 - dBc BFG2 BFG3 rejection of a blocking signal in occurrence around: FG1 = 3150.144 MHz rejection of a blocking signal in occurrence around: FG1 = 3779.136 MHz RF input resistance (real part of the parallel input impedance) RF input capacitance (imaginary part of the parallel input impedance) maximum RF input frequency minimum RF input frequency return loss on matched RF input balanced; note 1 balanced; at 1890 MHz 37 20 49 30 - - dBc dBc Receive section Ri(RF) Ci(RF) f(RF)(max) f(RF)(min) RLi(RF)(m) Ri(lo) Ci(lo) RLi(lo) Pi(lo) Gdem Notes 1. Measured on the Philips Semiconductors characterisation board at the RF balun input. 2. Measured on the Philips Semiconductors characterisation board at the LO balun input. - - - 11 - - balanced; note 2 9 - - 70 0.8 - 15 - - pF 1930 MHz - - - - - - - MHz dB pF dB dBm 1880 - Local oscillator section LO input resistance (real part of the parallel input impedance) LO input capacitance (imaginary part of the parallel input impedance) return loss on matched LO input LO input power level balanced; at 1890 MHz 140 0.3 12 -15 1.5 Demodulator section demodulator gain V/MHz 2000 Feb 15 8 Philips Semiconductors Product specification DECT receiver UAA3540TS handbook, full pagewidth 2.4 FCA090 VRSSI (V) 2.0 1.6 1.2 0.8 0.4 0 -102 -96 -90 -84 -78 -72 -66 -60 -54 -48 -42 -36 -30 -24 -18 -12 -6 0 6 12 18 Pi(RF) (dBm) VCC = 3.2 V; Tamb = 25oC. Fig.3 RSSI output voltage as a function of RF input power. APPLICATION INFORMATION handbook, full pagewidth GND(LO) power down control signal VCC L = 6.8 nH 1.2 pF 2.7 pF L = 6.8 nH 2.7 pF PD VCC(RF) GND(RF) RFA RFB 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 TEST4 VCC(LO) LOB LOA VCC(IF) RSSI TEST3 DATA+ TEST2 DATA- 4.7 nF 27 pF VCC digital data output 8.2 pF VCC RSSI output VCC 8.2 pF symmetrical LO signal from VCO RF input L = 6.8 nH 1.2 pF UAA3540TS 15 14 13 12 11 FCA041 GND(IF) RSET 18 k TEST1 SLCCTR slicer control input signal Fig.4 Application diagram. 2000 Feb 15 9 Philips Semiconductors Product specification DECT receiver PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm UAA3540TS SOT266-1 D E A X c y HE vM A Z 20 11 Q A2 pin 1 index A1 (A 3) Lp L A 1 e bp 10 detail X wM 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC MO-152 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-22 99-12-27 2000 Feb 15 10 Philips Semiconductors Product specification DECT receiver SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: UAA3540TS * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2000 Feb 15 11 Philips Semiconductors Product specification DECT receiver Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not UAA3540TS REFLOW(1) 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. 2000 Feb 15 12 Philips Semiconductors Product specification DECT receiver NOTES UAA3540TS 2000 Feb 15 13 Philips Semiconductors Product specification DECT receiver NOTES UAA3540TS 2000 Feb 15 14 Philips Semiconductors Product specification DECT receiver NOTES UAA3540TS 2000 Feb 15 15 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000 Internet: http://www.semiconductors.philips.com SCA 69 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403506/02/pp16 Date of release: 2000 Feb 15 Document order number: 9397 750 06422 |
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